US Patent 8492891 Cu pillar bump with electrolytic metal sidewall protection
Patent 8492891 was granted and assigned to Taiwan Semiconductor Manufacturing Company on July, 2013 by the United States Patent and Trademark Office.
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Patent abstract
A copper pillar bump has a sidewall protection layer formed of an electrolytic metal layer. The electrolytic metal layer is an electrolytic nickel layer, an electrolytic gold layer, and electrolytic copper layer, or an electrolytic silver layer.
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US Patent 08492891 Cu pillar bump with electrolytic metal sidewall protection US Patent 8492891 Cu pillar bump with electrolytic metal sidewall protection
Infobox
Patent Number
0849289100
Patent Number
849289100
Edits on 30 Apr, 2023
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
084928910
Date of Patent
July 23, 2013
0Patent Application Number
127652500
Date Filed
April 22, 2010
0Patent Primary Examiner
Edits on 27 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
084928910
Date of Patent
July 23, 2013
0Patent Application Number
127652500
Date Filed
April 22, 2010
0Patent Primary Examiner
Edits on 17 Dec, 2021
Golden AI
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Infobox (+8 properties)
US Patent 08492891 Cu pillar bump with electrolytic metal sidewall protection
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
08492891
Date of patent
July 23, 2013
Patent application number
12765250
Date Filed
April 22, 2010
Patent primary examiner
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