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US Patent 11906574 Hybrid socket warp indicator
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Patent
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Date Filed
July 7, 2021
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Date of Patent
February 20, 2024
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Patent Application Number
17369180
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Patent Citations
US Patent 8389864 Warp reactive IC package
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US Patent 9247636 Area array device connection structures with complimentary warp characteristics
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US Patent 10697851 Electro-mechanical fuse for detecting monitored component deflection
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US Patent 9609744 Area array device connection structures with complimentary warp characteristics
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US Patent 11558964 Process for in-situ warpage monitoring during solder reflow for head-in-pillow defect escape prevention
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US Patent 7438581 Socket having printed circuit board body portion
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US Patent 7648847 In-situ monitoring and method to determine accumulated printed wiring board thermal and/or vibration stress fatigue using a mirrored monitor chip and continuity circuit
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Patent Inventor Names
Theron Lee Lewis
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Timothy P. Younger
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James D. Bielick
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Stephen Michael Hugo
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Jennifer I. Bennett
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David J. Braun
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John R. Dangler
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Timothy Jennings
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11906574
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Patent Primary Examiner
Vinh P Nguyen
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CPC Code
H05K 2201/10734
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H05K 3/4007
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H05K 2201/068
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H05K 1/181
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H05K 1/111
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H05K 1/0268
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H01R 12/57
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G01R 31/2812
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G01R 31/281
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G01B 7/345
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