Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 11908756 Interposer chips and enclosures for quantum circuits

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
December 16, 2021
0
Date of Patent
February 20, 2024
0
Patent Application Number
17644695
0
Patent Citations
‌
US Patent 11536897 Multi-chip photonic quantum computer assembly with optical backplane interposer
0
‌
US Patent 9836699 Microwave integrated quantum circuits with interposer
0
‌
US Patent 10134972 Qubit and coupler circuit structures and coupling techniques
0
‌
US Patent 8519543 Large sized silicon interposers overcoming the reticle area limitations
0
‌
US Patent 9224647 Semiconductor device and method of forming TSV interposer with semiconductor die and build-up interconnect structure on opposing surfaces of the interposer
0
‌
US Patent 9269659 Interposer with overmolded vias
0
Patent Inventor Names
John Michael Cotte
0
David Abraham
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
11908756
0
Patent Primary Examiner
‌
Peniel M Gumedzoe
0
CPC Code
‌
H01L 23/16
0
‌
H01L 23/49888
0
‌
H01L 23/06
0
‌
H01L 21/52
0
‌
H01L 23/049
0
‌
H01L 23/552
0
‌
H01L 23/13
0

Find more entities like US Patent 11908756 Interposer chips and enclosures for quantum circuits

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo