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US Patent 9836699 Microwave integrated quantum circuits with interposer

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Contents

Is a
Patent
Patent

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
9836699
Patent Inventor Names
Mehrnoosh Vahidpour0
Chad Tyler Rigetti0
Dane Christoffer Thompson0
Jean-Luc François-Xavier Orgiazzi0
Michael Selvanayagam0
Richard Maydra0
Shane Caldwell0
Date of Patent
December 5, 2017
Patent Application Number
15140261
Date Filed
April 27, 2016
Patent Citations Received
‌
US Patent 11955465 Reducing loss in stacked quantum devices
0
‌
US Patent 11960972 Using a quantum processor unit to preprocess data
0
‌
US Patent 12107065 Uniform chip gaps via injection-molded solder pillars
0
‌
US Patent 11770982 Microwave integrated quantum circuits with cap wafers and their methods of manufacture
‌
US Patent 12027437 Superconducting device having a plurality of thermal sink layers and a plurality of ground planes
0
‌
US Patent 12001923 Quantum streaming kernel
0
‌
US Patent 12108690 Quantum device
0
‌
US Patent 11805708 Quantum device
...
Patent Primary Examiner
‌
Sophia Nguyen
Patent abstract

A quantum computing apparatus, including a quantum circuit device; and an interposer including a connectorization layer including a plurality of terminals for connecting the quantum computing apparatus to a corresponding plurality of cables and a plurality of signal lines electrically coupled, via electrical contacts, to the plurality of terminals; and at least one intermediate layer between the quantum circuit device and the connectorization layer, the at least one intermediate layer comprising an integrated circuit layer, the at least one intermediate layer being electrically coupled to the signal lines of the interposer. The interposer is configured to supply the quantum circuit device, during operation of the quantum computing apparatus, at least control signals and readout signals to and from the plurality of cables.

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