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US Patent 9836699 Microwave integrated quantum circuits with interposer

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
April 27, 2016
Date of Patent
December 5, 2017
Patent Application Number
15140261
Patent Citations Received
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US Patent 11955465 Reducing loss in stacked quantum devices
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US Patent 11960972 Using a quantum processor unit to preprocess data
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US Patent 12107065 Uniform chip gaps via injection-molded solder pillars
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US Patent 11770982 Microwave integrated quantum circuits with cap wafers and their methods of manufacture
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US Patent 12027437 Superconducting device having a plurality of thermal sink layers and a plurality of ground planes
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US Patent 12001923 Quantum streaming kernel
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US Patent 12108690 Quantum device
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US Patent 11805708 Quantum device
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US Patent 11908756 Interposer chips and enclosures for quantum circuits
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Patent Inventor Names
Mehrnoosh Vahidpour
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Chad Tyler Rigetti
0
Dane Christoffer Thompson
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Jean-Luc François-Xavier Orgiazzi
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Michael Selvanayagam
0
Richard Maydra
0
Shane Caldwell
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
9836699
Patent Primary Examiner
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Sophia Nguyen

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