Patent attributes
In a semiconductor device, a first interposer has a first main surface. A second interposer is disposed on the first main surface. The second interposer has a second main surface on a side opposite to the first interposer. A material of the second interposer is different from that of the first interposer. A first semiconductor chip has a first front surface. The first semiconductor chip is mounted on the second main surface through a plurality of bump electrodes with the first front surface facing the second main surface. The first semiconductor chip includes a volatile memory circuit. A second semiconductor chip is mounted on a plurality of electrode patterns disposed on the first main surface or the second main surface through a plurality of bonding wires. The second interposer overlaps the first semiconductor chip in a direction perpendicular to the first main surface.
