Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chin-Chou Liu0
Ming-Fa Chen0
Fong-Yuan Chang0
Yi-Kan Cheng0
Sen-Bor Jan0
Noor Mohamed Ettuveettil0
Po-Hsiang Huang0
Date of Patent
March 5, 2024
0Patent Application Number
178546830
Date Filed
June 30, 2022
0Patent Citations
Patent Primary Examiner
Patent abstract
Semiconductor devices and methods of manufacture are provided wherein a metallization layer is located over a substrate, and a power grid line is located within the metallization layer. A signal pad is located within the metallization layer and the signal pad is surrounded by the power grid line. A signal external connection is electrically connected to the signal pad.
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