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US Patent 11923302 Semiconductor device and method of manufacture
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Patent
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Date Filed
June 30, 2022
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Date of Patent
March 5, 2024
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Patent Application Number
17854683
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Patent Citations
US Patent 7514789 Ball grid array package-to-board interconnect co-design apparatus
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Patent Inventor Names
Chin-Chou Liu
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Ming-Fa Chen
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Fong-Yuan Chang
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Yi-Kan Cheng
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Sen-Bor Jan
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Noor Mohamed Ettuveettil
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Po-Hsiang Huang
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11923302
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Patent Primary Examiner
Mohammad A Rahman
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CPC Code
H01L 2224/05554
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H01L 2224/05647
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H01L 2224/0613
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H01L 2224/06133
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H01L 2224/80011
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H01L 2224/80013
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H01L 2224/80203
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H01L 2224/80805
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H01L 2224/80815
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H01L 2224/80895
0
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