US Patent 11923323 High-density flip chip package for wireless transceivers

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Patent

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Patent Applicant

Qualcomm

Current Assignee

Qualcomm

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

119233230

Patent Inventor Names

Mohamed Abouzied0

Bhushan Shanti Asuri0

Ibrahim Ramez Chamas0

Date of Patent

March 5, 2024

Patent Application Number

178439860

Date Filed

June 18, 2022

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US Patent 10950542 High-performance variable gain amplifier employing laminate transmission line structures

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...

Patent abstract

An RF flip chip is provided in which a local bump region adjacent a die corner includes a balun having a centrally-located bump.

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US Patent 11923323 High-density flip chip package for wireless transceivers

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