US Patent 11923323 High-density flip chip package for wireless transceivers
Patent 11923323 was granted and assigned to Qualcomm on March, 2024 by the United States Patent and Trademark Office.
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US Patent 11923323 High-density flip chip package for wireless transceivers
Article
Patent abstract
An RF flip chip is provided in which a local bump region adjacent a die corner includes a balun having a centrally-located bump.
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Bhushan Shanti Asuri0
Ibrahim Ramez Chamas0
Mohamed Abouzied0
Date of Patent
March 5, 2024
0Patent Application Number
178439860
Date Filed
June 18, 2022
0Patent Citations
Patent Primary Examiner
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