Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Shenggao Li0
Date of Patent
March 12, 2024
0Patent Application Number
183008620
Date Filed
April 14, 2023
0Patent Citations
Patent Primary Examiner
CPC Code
Patent abstract
A method includes forming a first package component, and forming a first plurality of electrical connectors at a first surface of the first package component. The first plurality of electrical connectors are laid out as having a honeycomb pattern. A second package component is bonded to the first package component, wherein a second plurality of electrical connectors at a second surface of the second package component are bonded to the first plurality of electrical connectors.
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