US Patent 11929338 Honeycomb pattern for conductive features
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US Patent 11929338 Honeycomb pattern for conductive features
Article
Patent abstract
A method includes forming a first package component, and forming a first plurality of electrical connectors at a first surface of the first package component. The first plurality of electrical connectors are laid out as having a honeycomb pattern. A second package component is bonded to the first package component, wherein a second plurality of electrical connectors at a second surface of the second package component are bonded to the first plurality of electrical connectors.
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Patent Number
Patent Inventor Names
Shenggao Li0
Date of Patent
March 12, 2024
0Patent Application Number
183008620
Date Filed
April 14, 2023
0Patent Citations
Patent Primary Examiner
CPC Code
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