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US Patent 11929347 Mixed exposure for large die

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
January 19, 2022
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Date of Patent
March 12, 2024
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Patent Application Number
17579259
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Patent Citations
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US Patent 11011494 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics
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US Patent 11296044 Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes
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US Patent 11296053 Direct bonded stack structures for increased reliability and improved yield in microelectronics
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US Patent 11329034 Direct-bonded LED structure contacts and substrate contacts
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US Patent 11348898 Systems and methods for releveled bump planes for chiplets
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US Patent 11355404 Mitigating surface damage of probe pads in preparation for direct bonding of a substrate
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US Patent 11355443 Dielets on flexible and stretchable packaging for microelectronics
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US Patent 11367652 Microelectronic assembly from processed substrate
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US Patent 11373963 Protective elements for bonded structures
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US Patent 11380597 Bonded structures
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•••
Patent Inventor Names
Belgacem Haba
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Javier A. Delacruz
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11929347
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Patent Primary Examiner
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Elias Ullah
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CPC Code
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H01L 2224/08225
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H01L 2924/15192
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H01L 2924/15311
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G03F 7/70433
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G03F 7/70458
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G03F 7/70466
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G03F 7/203
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H01L 24/97
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H01L 21/682
0
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H01L 23/5384
0
•••

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