Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Siddharth K. Alur0
Wei-Lun K. Jen0
Amruthavalli P. Alur0
Sri Chaitra J. Chavali0
Ashish Dhall0
Kyu Oh Lee0
Rahul Jain0
Vipul V. Mehta0
...
Date of Patent
March 19, 2024
0Patent Application Number
181338680
Date Filed
April 12, 2023
0Patent Citations
Patent Primary Examiner
Patent abstract
An apparatus is provided which comprises: a substrate, a die site on the substrate to couple with a die, a die side component site on the substrate to couple with a die side component, and a raised barrier on the substrate between the die and die side component sites to contain underfill material disposed at the die site, wherein the raised barrier comprises electroplated metal. Other embodiments are also disclosed and claimed.
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