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US Patent 11942676 Single-package wireless communication device
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Patent
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Date Filed
January 9, 2023
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Date of Patent
March 26, 2024
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Patent Application Number
18151657
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Patent Citations
US Patent 7318349 Three-axis integrated MEMS accelerometer
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US Patent 7692295 Single package wireless communication device
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US Patent 10439265 Single-package wireless communication device
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US Patent 8138599 Wireless communication device integrated into a single package
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US Patent 10727567 Single-package wireless communication device
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US Patent 7132747 Multilayer integrated circuit for RF communication and method for assembly thereof
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US Patent 7176506 High frequency chip packages with connecting elements
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Patent Inventor Names
Mohamed A. Megahed
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11942676
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Patent Primary Examiner
Calvin Y Choi
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CPC Code
H01Q 1/48
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H01L 23/49838
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H01L 23/66
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H01L 25/0652
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H01L 25/0657
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H01L 25/16
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H01L 25/50
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H01L 24/48
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H01L 24/73
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H01L 2223/6677
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