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US Patent 11948808 Semiconductor device and manufacturing method thereof

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Is a

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Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Won Myoung Ki0

Jae Hun Bae0

Seung Nam Son0

Dong Jin Kim0

Do Hyung Kim0

Curtis Zwenger0

Dong Hoon Han0

Ji Hun Lee0

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Date of Patent

April 2, 2024

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Patent Application Number

175426660

Date Filed

December 6, 2021

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Patent Citations

US Patent 10510723 Buffer layer(s) on a stacked structure having a via

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US Patent 9524942 Chip-on-substrate packaging on carrier

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US Patent 9490231 Manufacturing method of semiconductor device and semiconductor device thereof

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US Patent 8618648 Methods for flip chip stacking

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Patent Primary Examiner

Yasser A Abdelaziez

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CPC Code

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H01L 2224/13294

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H01L 2224/16227

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H01L 2224/16237

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H01L 2224/16238

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Patent abstract

A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.

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