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US Patent 11948808 Semiconductor device and manufacturing method thereof

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
December 6, 2021
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Date of Patent
April 2, 2024
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Patent Application Number
17542666
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Patent Citations
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US Patent 10510723 Buffer layer(s) on a stacked structure having a via
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US Patent 9524942 Chip-on-substrate packaging on carrier
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US Patent 9490231 Manufacturing method of semiconductor device and semiconductor device thereof
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US Patent 8618648 Methods for flip chip stacking
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Patent Inventor Names
Won Myoung Ki
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Jae Hun Bae
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Seung Nam Son
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Dong Jin Kim
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Do Hyung Kim
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Curtis Zwenger
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Dong Hoon Han
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Ji Hun Lee
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Hyun Cho
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Jun Hwan Park
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•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11948808
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Patent Primary Examiner
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Yasser A Abdelaziez
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CPC Code
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H01L 2224/1132
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H01L 2224/131
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H01L 23/3128
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H01L 2224/13294
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H01L 2224/133
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H01L 2224/16227
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H01L 2224/16237
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H01L 2224/16238
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H01L 2224/32225
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H01L 2224/73204
0
•••

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