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US Patent 11955438 Thermally-conductive electromagnetic interference (EMI) absorbers

Overview Structured Data Issues Contributors Activity

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Date Filed

September 22, 2021

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Date of Patent

April 9, 2024

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Patent Application Number

17481426

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Patent Citations

US Patent 11229147 Thermally-conductive electromagnetic interference (EMI) absorbers with silicon carbide

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US Patent 10648750 Olefin block composite thermally conductive materials

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US Patent 10892204 Electromagnetic wave absorbing heat conductive sheet, method for producing electromagnetic wave absorbing heat conductive sheet, and semiconductor device

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US Patent 6962753 Highly heat-conductive composite magnetic material

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US Patent 7094822 Thermally conductive elastomeric pad

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US Patent 7417078 Electromagnetic wave absorbing thermally conductive composition and thermosoftening electromagnetic wave absorbing heat dissipation sheet and method of heat dissipation work

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US Patent 7550097 Thermal conductive material utilizing electrically conductive nanoparticles

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US Patent 7589147 Resin composition for thermal conductive material and thermal conductive material

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US Patent 9260645 Thermal interface materials including thermally reversible gels

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US Patent 9611414 Thermal interface material with mixed aspect ratio particle dispersions

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Patent Inventor Names

John David Ryan

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Karen Bruzda

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Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

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Patent Primary Examiner

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CPC Code

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