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US Patent 11956579 Lid, MEMS sensor component and methods of manufacturing

Patent 11956579 was granted and assigned to TDK on April, 2024 by the United States Patent and Trademark Office.

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Patent attributes

Patent Applicant

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Current Assignee

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Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Wolfgang Pahl0

Date of Patent

April 9, 2024

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Patent Application Number

176930090

Date Filed

March 11, 2022

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Patent Citations

US Patent 10435292 Method for producing a semiconductor module

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US Patent 7381589 Silicon condenser microphone and manufacturing method

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US Patent 8536663 Metal mesh lid MEMS package and method

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US Patent 9818665 Method of packaging a semiconductor chip using a 3D printing process and semiconductor package having angled surfaces

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Patent Primary Examiner

Angelica M McKinney

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Patent abstract

In an embodiment a lid includes a top section and a side section arranged below the top section. A vertical height of the top section is calculated by I

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