Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Anthony D. Minervini0
Date of Patent
June 3, 2008
0Patent Application Number
117418840
Date Filed
April 30, 2007
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A silicon condenser microphone package is disclosed. The silicon condenser microphone package comprises a transducer unit substrate, and a cover. The substrate includes an upper surface having a recess formed therein. The transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and includes an aperture.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
