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US Patent 11961743 Substrate manufacturing method for realizing three-dimensional packaging

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
December 8, 2021
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Date of Patent
April 16, 2024
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Patent Application Number
17544999
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Patent Citations
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US Patent 11889622 Electronic device with connected component carrier and fluid cooling member
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US Patent 8941244 Semiconductor device and manufacturing method thereof
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US Patent 10765005 Embedding component with pre-connected pillar in component carrier
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US Patent 11494682 Quantum computing assemblies
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US Patent 11626363 Bonded structures with integrated passive component
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Patent Inventor Names
Yejie Hong
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Lei Feng
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Xianming Chen
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Benxia Huang
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11961743
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Patent Primary Examiner
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Nikolay K Yushin
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CPC Code
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H05K 3/4092
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H05K 3/24
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H05K 3/3457
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H05K 3/40
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H05K 3/4611
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H05K 3/4652
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H05K 1/111
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H05K 1/11
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H05K 1/115
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H05K 1/112
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