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US Patent 11965103 Additive manufacturing of polishing pads

Patent 11965103 was granted and assigned to Applied Materials on April, 2024 by the United States Patent and Trademark Office.

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Is a

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Patent attributes

Patent Applicant

Applied Materials

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Current Assignee

Applied Materials

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Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Rajeev Bajaj0

Daniel Redfield0

Daihua Zhang0

Nag B. Patibandla0

Hou T. Ng0

Sivapackia Ganapathiappan0

Sudhakar Madhusoodhanan0

Ashwin Murugappan Chockalingam0

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Date of Patent

April 23, 2024

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Patent Application Number

169967440

Date Filed

August 18, 2020

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Patent Citations

US Patent 8480203 Inkjet printing methods and ink sets

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US Patent 9744724 Apparatus for printing a chemical mechanical polishing pad

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Patent Primary Examiner

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CPC Code

0

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Patent abstract

A formulation, system, and method for additive manufacturing of a polishing pad. The formulation includes monomer, dispersant, and nanoparticles. A method of preparing the formulation includes adding a dispersant that is a polyester derivative to monomer, adding metal-oxide nanoparticles to the monomer, and subjecting the monomer having the nanoparticles and dispersant to sonication to disperse the nanoparticles in the monomer.

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