US Patent 11965103 Additive manufacturing of polishing pads
Patent 11965103 was granted and assigned to Applied Materials on April, 2024 by the United States Patent and Trademark Office.
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US Patent 11965103 Additive manufacturing of polishing pads
Article
Patent abstract
A formulation, system, and method for additive manufacturing of a polishing pad. The formulation includes monomer, dispersant, and nanoparticles. A method of preparing the formulation includes adding a dispersant that is a polyester derivative to monomer, adding metal-oxide nanoparticles to the monomer, and subjecting the monomer having the nanoparticles and dispersant to sonication to disperse the nanoparticles in the monomer.
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Ashwin Murugappan Chockalingam0
Daihua Zhang0
Daniel Redfield0
Hou T. Ng0
Nag B. Patibandla0
Rajeev Bajaj0
Sivapackia Ganapathiappan0
Sudhakar Madhusoodhanan0
Uma Sridhar0
Yingdong Luo0
Date of Patent
April 23, 2024
0Patent Application Number
169967440
Date Filed
August 18, 2020
0Patent Citations
Patent Primary Examiner
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