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US Patent 11967497 Methods and apparatus for cleaning semiconductor wafers

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Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Fufa Chen0

Fuping Chen0

Jun Wang0

Hui Wang0

Yinuo Jin0

Xiaoyan Zhang0

Xi Wang0

Jian Wang0

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Date of Patent

April 23, 2024

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Patent Application Number

175752440

Date Filed

January 13, 2022

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Patent Citations

US Patent 7306002 System and method for wet cleaning a semiconductor wafer

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US Patent 7495371 Cleaning tank with sleeved ultrasonic transducer

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US Patent 7598654 Megasonic processing apparatus with frequency sweeping of thickness mode transducers

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US Patent 8310131 Megasonic processing apparatus with frequency sweeping of thickness mode transducers

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US Patent 9159311 Unrestricted mounting of ultrasonic transducers

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US Patent 8936032 Ultrasonic air blanket reflector

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US Patent 11257667 Methods and apparatus for cleaning semiconductor wafers

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US Patent 7119019 Capping of copper structures in hydrophobic ILD using aqueous electro-less bath

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Patent Primary Examiner

Alexander Markoff

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CPC Code

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Patent abstract

A method for cleaning semiconductor substrate without damaging patterned structure on the semiconductor substrate using ultra/mega sonic device comprises applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f

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