US Patent 11967497 Methods and apparatus for cleaning semiconductor wafers
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US Patent 11967497 Methods and apparatus for cleaning semiconductor wafers
Article
Patent abstract
A method for cleaning semiconductor substrate without damaging patterned structure on the semiconductor substrate using ultra/mega sonic device comprises applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f
Infobox
Is a
Patent Jurisdiction
Patent Number
Patent Inventor Names
Fufa Chen0
Fuping Chen0
Hui Wang0
Jian Wang0
Jun Wang0
Liangzhi Xie0
Xi Wang0
Xiaoyan Zhang0
Xuejun Li0
Yinuo Jin0
Zhaowei Jia0
Date of Patent
April 23, 2024
0Patent Application Number
175752440
Date Filed
January 13, 2022
0Patent Citations
Patent Primary Examiner
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