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US Patent 11967560 Integrated circuit

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
July 19, 2022
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Date of Patent
April 23, 2024
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Patent Application Number
17868065
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Patent Citations
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US Patent 8211791 Method for fabricating circuitry component
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US Patent 10867968 3DIC structure with protective structure and method of fabricating the same
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US Patent 8507957 Integrated circuit layouts with power rails under bottom metal layer
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US Patent 10878162 Metal with buried power for increased IC device density
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US Patent 8154128 3D integrated circuit layer interconnect
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US Patent 8164171 System-in packages
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Patent Inventor Names
Chia-Tien Wu
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Jiann-Tyng Tzeng
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Shih-Wei Peng
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11967560
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Patent Primary Examiner
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Bac H Au
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CPC Code
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H01L 21/76879
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H01L 23/5286
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H01L 23/5384
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H01L 23/5386
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H01L 21/76802
0

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