Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hsiang-Lan Lung0
Date of Patent
April 10, 2012
0Patent Application Number
125791920
Date Filed
October 14, 2009
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A three-dimensional 3D interconnect structure with a small footprint is described, useful for connection from above to levels of circuit structures in a multi-level device. Also, an efficient and low cost method for manufacturing the 3D interconnect structure is provided.
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