Patent attributes
Systems and methods for embedding electronics in a housing using additive manufacturing are provided. In certain embodiments, a system includes a housing made using an additive manufacturing process. The system also includes at least one electronics assembly that is embedded into the housing during the additive manufacturing process, wherein one or more electronic components on the at least one electronic assembly are isolated from the material used to form the housing. Further, the system includes an electrical connector coupled to at least one electronic component in the one or more electronic components, wherein the electrical connector provides an electrical connection between the at least one electronic assembly and system electronics that are outside the housing, wherein the electronic assembly is environmentally sealed within the housing from the environment outside the housing.
