Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
January 31, 2017
Patent Application Number
14700601
Date Filed
April 30, 2015
Patent Citations Received
0
Patent Primary Examiner
Patent abstract
A package for a semiconductor device or circuit comprises a semiconductor switch module having a metallic base on an exterior side and metallic pads. A metallic enclosure is arranged for receiving the semiconductor switch module. The metallic enclosure has a recess of a size and shape for receiving the semiconductor switch module. The metallic enclosure has a set of dielectric regions with embedded or pass-through electrical terminals that are electrically insulated or isolated from the metallic enclosure. The electrical terminals are electrically connected to the metallic pads. A metallic bridging connection fills and hydraulically seals what would otherwise be a perimeter gap between the metallic base and the metallic enclosure.
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