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US Patent 11988468 Heat sink and housing assembly

Overview Structured Data Issues Contributors Activity

Is a

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Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Zhicheng Li1

Jiwang Jin1

Yan Lee1

Hongqiang Han1

WenYu Liu1

Lei Liu1

Date of Patent

May 21, 2024

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Patent Application Number

165875461

Date Filed

September 30, 2019

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Patent Citations

US Patent 7070446 Stacked SFP connector and cage assembly

1

US Patent 7355857 Heat sink gasket

1

US Patent 7426956 Heat dissipating apparatus

1

US Patent 7610948 Cooler module

1

US Patent 8051896 Apparatus for spreading heat over a finned surface

1

US Patent 8345445 Heat sink assembly for a pluggable module

1

US Patent 8449331 Cage and connector cover for a receptacle assembly

1

US Patent 8535787 Heat sinks having a thermal interface for cooling electronic devices

1

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Patent Primary Examiner

Raheena R Malik

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CPC Code

1

1

1

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1

1

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Patent abstract

A heat sink includes a heat sink body having a plurality of stacked fins and a mounting base. The mounting base has a first heat dissipation plate and a second heat dissipation plate. A first surface of the first heat dissipation plate is connected to a bottom of the heat sink body. The second heat dissipation plate is mounted on a second surface of the first heat dissipation plate opposite to the first surface.

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