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US Patent 11988468 Heat sink and housing assembly
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Patent
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Date Filed
September 30, 2019
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Date of Patent
May 21, 2024
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Patent Application Number
16587546
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Patent Citations
US Patent 7070446 Stacked SFP connector and cage assembly
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US Patent 7355857 Heat sink gasket
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US Patent 7426956 Heat dissipating apparatus
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US Patent 7610948 Cooler module
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US Patent 8051896 Apparatus for spreading heat over a finned surface
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US Patent 8345445 Heat sink assembly for a pluggable module
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US Patent 8449331 Cage and connector cover for a receptacle assembly
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US Patent 8535787 Heat sinks having a thermal interface for cooling electronic devices
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US Patent 8857502 Vapor chamber having heated protrusion
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US Patent 8879267 Transceiver assembly
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•••
Patent Inventor Names
Zhicheng Li
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Jiwang Jin
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Yan Lee
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Hongqiang Han
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WenYu Liu
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Lei Liu
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11988468
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Patent Primary Examiner
Raheena R Malik
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CPC Code
H05K 7/20445
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H05K 7/20472
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H05K 7/2049
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H05K 7/20509
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H05K 7/20854
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H05K 7/209
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H01L 21/4878
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H01L 21/4882
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H01L 23/36
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H01L 23/3672
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•••
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