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US Patent 11988961 Radiation based patterning methods

Patent 11988961 was granted and assigned to Inpria on May, 2024 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
0
Current Assignee
Inpria
Inpria
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Date Filed
May 22, 2023
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Date of Patent
May 21, 2024
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Patent Applicant
Inpria
Inpria
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Patent Application Number
18200125
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Patent Citations
‌
US Patent 7256129 Method for fabricating semiconductor device
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US Patent 7270886 Spin-on glass composition and method of forming silicon oxide layer in semiconductor manufacturing process using the same
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US Patent 8053370 Semiconductor device and fabrications thereof
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US Patent 8092703 Manufacturing method of semiconductor device
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US Patent 8158338 Resist sensitizer
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US Patent 8257910 Underlayers for EUV lithography
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US Patent 8415000 Patterned inorganic layers, radiation based patterning compositions and corresponding methods
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US Patent 8426107 Positive-type photosensitive composition
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US Patent 8703386 Metal peroxo compounds with organic co-ligands for electron beam, deep UV and extreme UV photoresist applications
0
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US Patent 8828493 Methods of directed self-assembly and layered structures formed therefrom
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•••
Patent Inventor Names
Alan J. Telecky
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Andrew Grenville
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Douglas A. Keszler
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Jason K. Stowers
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11988961
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Patent Primary Examiner
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Chanceity N Robinson
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CPC Code
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G03F 7/0042
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