Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Noufal Kappachali0
Haitao Wang0
Xiangjin Xie0
Yida Lin0
Rui Li0
Martin Lee Riker0
Date of Patent
May 21, 2024
0Patent Application Number
175688360
Date Filed
January 5, 2022
0Patent Citations
Patent Primary Examiner
CPC Code
Patent abstract
Methods and apparatus for processing a substrate are provided herein. For example, an RF power delivery compensation circuit comprises a first input configured to receive an RF forward power from an RF power source connected to a processing chamber and a second input configured to receive an RF delivered power from a matching network connected between the RF power source and the processing chamber. The RF power delivery compensation circuit calculates an RF forward power compensation factor based on the RF forward power and the RF delivered power for adjusting the RF forward power delivered to the processing chamber during operation.
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