US Patent 11990319 Methods and apparatus for processing a substrate
Patent 11990319 was granted and assigned to Applied Materials on May, 2024 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
January 5, 2022
0
Date of Patent
May 21, 2024
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Patent Applicant
Patent Application Number
17568836
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Patent Citations
Patent Inventor Names
Noufal Kappachali
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Haitao Wang
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Xiangjin Xie
0
Yida Lin
0
Rui Li
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Martin Lee Riker
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Patent Jurisdiction
Patent Number
Patent Primary Examiner
CPC Code
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