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US Patent 11997782 Thermally conductive label for circuit

Patent 11997782 was granted and assigned to Micron Technology on May, 2024 by the United States Patent and Trademark Office.

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Patent abstract

Various embodiments described herein provide a label configured for thermal conductivity and configured to pass over an edge of a printed circuit board (PCB) and attached to both sides of the printed circuit board. The label can be used with a printed circuit board that is associated with a memory sub-system, such as a memory module (e.g., solid state drive, SSD module).

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