US Patent 11997782 Thermally conductive label for circuit
Patent 11997782 was granted and assigned to Micron Technology on May, 2024 by the United States Patent and Trademark Office.
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US Patent 11997782 Thermally conductive label for circuit
Article
Patent abstract
Various embodiments described herein provide a label configured for thermal conductivity and configured to pass over an edge of a printed circuit board (PCB) and attached to both sides of the printed circuit board. The label can be used with a printed circuit board that is associated with a memory sub-system, such as a memory module (e.g., solid state drive, SSD module).
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Bradley Russell Bitz0
João Elmiro Da Rocha Chaves0
Kaleb A. Wilson0
Mark A. Tverdy0
Shams U Arifeen0
Date of Patent
May 28, 2024
0Patent Application Number
174591020
Date Filed
August 27, 2021
0Patent Citations
Patent Primary Examiner
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