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US Patent 12009282 Memory device and memory device module

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
March 11, 2021
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Date of Patent
June 11, 2024
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Patent Application Number
18258190
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Patent Citations
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US Patent 9842799 Semiconductor packages including upper and lower packages and heat dissipation parts
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US Patent 10211190 Semiconductor packages having reduced stress
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US Patent 8811019 Electronic device, method for producing the same, and printed circuit board comprising electronic device
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US Patent 9589945 Semiconductor package having stacked semiconductor chips
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Patent Inventor Names
Shuzo Akejima
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
12009282
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Patent Primary Examiner
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Kyoung Lee
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CPC Code
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H01L 23/5386
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H01L 23/3677
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H01L 2225/1094
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H01L 25/0655
0
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H01L 23/5383
0

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