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US Patent 12009338 Dimension compensation control for directly bonded structures

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
March 19, 2021
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Date of Patent
June 11, 2024
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Patent Application Number
17206725
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Patent Citations
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US Patent 10886177 3D chip with shared clock distribution network
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US Patent 11056348 Bonding surfaces for microelectronics
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US Patent 11069734 Image sensor device
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US Patent 11176450 Three dimensional circuit implementing machine trained network
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US Patent 11222863 Techniques for die stacking and associated configurations
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US Patent 11256004 Direct-bonded lamination for improved image clarity in optical devices
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US Patent 11264357 Mixed exposure for large die
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US Patent 11276676 Stacked devices and methods of fabrication
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US Patent 11329034 Direct-bonded LED structure contacts and substrate contacts
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US Patent 11348898 Systems and methods for releveled bump planes for chiplets
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•••
Patent Inventor Names
Gaius Gillman Fountain, Jr.
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Guilian Gao
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Cyprian Emeka Uzoh
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Laura Wills Mirkarimi
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
12009338
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Patent Primary Examiner
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Hoa B Trinh
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CPC Code
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H01L 2224/08145
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H01L 2224/80031
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H01L 2224/80143
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H01L 2224/80895
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H01L 2224/80896
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