Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Ahmad Faridzul Hilmi Shamsuddin0
Chun Sean Lau0
Shankara Venkatraman Gopalan0
Warren Middlekauff0
Bo Yang0
Ning Ye0
Date of Patent
June 18, 2024
0Patent Application Number
177246890
Date Filed
April 20, 2022
0Patent Citations
Patent Primary Examiner
Patent abstract
A protective enclosure for a PCB assembly, e.g., a solid-state-drive assembly. In an example embodiment, the enclosure comprises a flexible, stamped-metal heat spreader connected, by way of cured-liquid TIM parts, to at least some of the packaged integrated circuits on one side of the PCB assembly. In some embodiments, additional cured-liquid TIM parts may be connected between the body of the protective enclosure and packaged integrated circuits on the other side of the PCB assembly and/or the assembly's PCB. The PCB assembly, heat spreader, and various TIM parts are arranged in a manner that helps to significantly lower the risk of solder-joint failure under thermal cycling.
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