Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Daniel Kim0
Date of Patent
October 3, 2017
0Patent Application Number
148458450
Date Filed
September 4, 2015
0Patent Citations Received
Patent Primary Examiner
Patent abstract
An apparatus for cooling a POP stacked package within a small form factor electronic module by configuring the enclosure of the module to come into direct contact with the device on the top surface in addition to the bottom surface to create two thermal conduction paths for the POP device to the enclosure. The enclosure itself then acts as the heat sink to draw heat from the device and into the surrounding air external to the optical module.
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