Patent attributes
A laser processing machine for killing specific cells from a group of cells on a surface of a layer containing an ingredient capable of absorbing laser light, the laser processing machine being configured to: control a laser light source to output laser light at 5W or less and at a wavelength of 380 nm or greater such that the laser light source is applied to a second area on a second surface of the layer opposed to the first surface; and control an actuator to provide a relative movement between the second area where the laser light is applied and the layer at a rate of 2000 mm/sec or less such that the irradiated second area absorbs energy to generate heat that kills unwanted cells on a first area of the first surface and the laser light does not instantly kill the specific cells on the first area upon irradiation.
