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US Patent 12021005 Semiconductor device including a thermal material

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
March 18, 2022
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Date of Patent
June 25, 2024
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Patent Application Number
17698508
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Patent Citations
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US Patent 11075138 Semiconductor package system
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US Patent 11670569 Channeled lids for integrated circuit packages
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US Patent 8710448 Radiation detector array
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US Patent 8922024 Semiconductor packages including molding layers
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US Patent 9287191 Semiconductor device package and method
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US Patent 9905526 Electronic component package and method of manufacturing the same
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US Patent 10607963 Chip package for two-phase cooling and assembly process thereof
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US Patent 10643924 Heat-dissipating lid with reservoir structure and associated lidded flip chip package allowing for liquid thermal interfacing materials
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US Patent 10727368 Optoelectronic device module having a silicon interposer
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US Patent 6891259 Semiconductor package having dam and method for fabricating the same
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•••
Patent Inventor Names
Yu Jin Jeon
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Young Ik Kwon
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Mi Kyoung Choi
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Keun Soo Kim
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
12021005
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Patent Primary Examiner
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Ida M. Soward
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CPC Code
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H01L 2224/73204
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H01L 2224/73253
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H01L 2224/73265
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H01L 2225/0651
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H01L 2225/06568
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H01L 2225/1023
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H01L 2225/1058
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H01L 2225/1094
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H01L 2924/161
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H01L 2924/10158
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•••

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