US Patent 8922024 Semiconductor packages including molding layers

Patent 8922024 was granted and assigned to SAMSUNG ELECTRONICS CO., LTD. on December, 2014 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Patent Applicant

Samsung

Current Assignee

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

89220240

Patent Inventor Names

Minok Na0

Ji-Hyun Park0

Okgyeong Park0

Date of Patent

December 30, 2014

Patent Application Number

138299390

Date Filed

March 14, 2013

Patent Citations Received

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US Patent 12021005 Semiconductor device including a thermal material

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US Patent 11948855 Integrated circuit (IC) package with cantilever multi-chip module (MCM) heat spreader

Patent Primary Examiner

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S. V. Clark

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