US Patent 8922024 Semiconductor packages including molding layers
Patent 8922024 was granted and assigned to SAMSUNG ELECTRONICS CO., LTD. on December, 2014 by the United States Patent and Trademark Office.
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Patent Inventor Names
Ji-Hyun Park0
Minok Na0
Okgyeong Park0
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US Patent 08922024 Semiconductor packages including molding layers US Patent 8922024 Semiconductor packages including molding layers
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Patent Number
089220240
Patent Number
89220240
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Patent Applicant
Current Assignee
0
Patent Jurisdiction
Patent Number
089220240
Date of Patent
December 30, 2014
0Patent Application Number
138299390
Date Filed
March 14, 2013
0Official Website
Patent Primary Examiner
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US Patent 08922024 Semiconductor packages including molding layers
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
08922024
Date of patent
December 30, 2014
Patent application number
13829939
Date Filed
March 14, 2013
Patent primary examiner
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