Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yu-Wei Huang0
Shau-Fei Cheng0
Date of Patent
June 25, 2024
0Patent Application Number
176944450
Date Filed
March 14, 2022
0Patent Citations
Patent Primary Examiner
Patent abstract
This disclosure provides a conductive circuit carrier module including a carrier and a conductive circuit film layer. The conductive circuit film layer is disposed on the carrier. The conductive circuit film layer has at least one conductive circuit structure including a vertical wire part and at least four horizontal wire parts. The vertical wire part extends along a thickness direction of the conductive circuit film layer. The at least four horizontal wire parts are connected to one another via the vertical wire part and extend along a direction substantially perpendicular to the vertical wire part. The at least four horizontal wire parts are symmetrically arranged or asymmetrically arranged with respect to the vertical wire part.
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