Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Dyi-Chung Hu0
Date of Patent
January 10, 2017
0Patent Application Number
148594640
Date Filed
September 21, 2015
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A package substrate having a first redistribution layer (RDL1) and a second redistribution layer (RDL2) is disclosed for a multichip package. The first redistribution layer RDL1 is built according to a first design rule. The second redistribution layer RDL2 is built according to a second design rule and configured on a bottom of the first redistribution layer RDL1. The second design rule has a lower circuitry density than the first design rule has. A lateral communication circuitry is built within the first redistribution layer RDL1 according to the first design rule adaptive for bridging neighboring chips which are configured on a top surface of the first redistribution layer RDL1.
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