Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yi-Jou Lin0
I-Hsuan Peng0
Tzu-Hung Lin0
Chia-Cheng Chang0
Date of Patent
January 2, 2024
0Patent Application Number
175757890
Date Filed
January 14, 2022
0Patent Citations
...
Patent Primary Examiner
Patent abstract
A semiconductor package structure is provided. The semiconductor package structure includes a substrate, a semiconductor die disposed over the substrate, and a frame disposed over the substrate. The frame is adjacent to the semiconductor die, and an upper surface of the frame is lower than the upper surface of the semiconductor die. IN addition, a passive component is disposed on the substrate and located between the frame and the semiconductor die.
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