Patent attributes
A semiconductor structure and a method of manufacture are provided. Devices, such as integrated circuit dies, are mounted on a substrate, such as another die, packaging substrate, interposer, or the like, and recesses are formed in the substrate along the scribe lines. One or more molding compound layers are formed in the recesses and between adjacent dies. A backside thinning process may be performed to expose the molding compound in the recesses. A singulation process is performed in the molding compound layer in the recesses. In an embodiment, a first molding compound layer is formed in the recess, and a second molding compound is formed over the first molding compound layer and between adjacent dies. The devices may be placed on the substrate before or after forming the recesses.