Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 12027470 Package carrier having a stiffener between solder bumps

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
December 9, 2021
0
Date of Patent
July 2, 2024
0
Patent Application Number
17547200
0
Patent Citations
‌
US Patent 9502322 Molding compound supported RDL for IC package
0
‌
US Patent 10290609 Semiconductor device and manufacturing method of the same
0
‌
US Patent 10475752 Semiconductor package structure and method of making the same
0
‌
US Patent 11450622 Semiconductor package
0
‌
US Patent 11362010 Structure and formation method of chip package with fan-out feature
0
‌
US Patent 11569156 Semiconductor device, electronic device including the same, and manufacturing method thereof
0
‌
US Patent 8946564 Packaging substrate having embedded through-via interposer and method of fabricating the same
0
‌
US Patent 9478472 Substrate components for packaging IC chips and electronic device packages of the same
0
Patent Inventor Names
Chao-Jung Chen
0
Ren-Shin Cheng
0
Po-Chih Chang
0
Yu-Min Lin
0
Ang-Ying Lin
0
Ching-Kuan Lee
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
12027470
0
Patent Primary Examiner
‌
Alonzo Chambliss
0
CPC Code
‌
H01L 23/49838
0
‌
H01L 23/49816
0
‌
H01L 23/3107
0
‌
H01L 21/481
0
‌
H01L 21/4857
0
‌
H01L 21/568
0
‌
H01L 21/56
0
‌
H01L 21/4846
0
‌
H01L 24/14
0
‌
H01L 24/17
0
•••

Find more entities like US Patent 12027470 Package carrier having a stiffener between solder bumps

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo