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US Patent 12028043 Packaging method and packaging structure of FBAR
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Patent
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Date Filed
February 26, 2021
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Date of Patent
July 2, 2024
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Patent Application Number
17249347
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Patent Citations
US Patent 8303755 Manufacturing methods of piezoelectric devices
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US Patent 9646874 Thermally-isolated silicon-based integrated circuits and related methods
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US Patent 7282388 Method of manufacturing wafer level package type FBAR device
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Patent Inventor Names
Hailong Luo
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
12028043
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Patent Primary Examiner
Jeffrey T Carley
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CPC Code
H03H 9/173
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H03H 9/15
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H03H 9/105
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H03H 2003/021
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H03H 3/02
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H03H 9/1007
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